PLT Instruments Pte Ltd-Plasma decap

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Plasma decap

As a reverse process in semiconductor manufacturing, failure analysis requires the removal of the plastic packaging material that wraps around the chip, and material and electrical analysis of the chip. The decap of the device is crucial, and unnecessary plastic packaging materials should be removed while retaining the main structures such as the chip and solder wires. Traditional mechanical decap, chemical decap, and laser decap that have become popular in recent years all require the use of strong acids for chip surface treatment. No matter environmental or safety, the acid treatment method is no longer suitable for the development of the times. Plasma decap uses hydrogen and oxygen as reaction gases, which have the advantages of environmental protection, safety, and wide application, and are increasingly accepted.

Unlike traditional RIE reaction ion etching equipment, the PLT plasma decap machine uses microwave as the plasma source, which has a higher frequency (2.4GHz) and power (up to 1000W), making it more suitable for decap electronic components. The PLT plasma decap machine uses vacuum plasma technology to input reaction gas into a vacuum chamber to form plasma, consuming less reaction gas. Simultaneously using a gas generator, the generation of gas is controlled by a program, no need for gas tank, and no safety issue need to be taken in terms of gas storage and use.

The vacuum plasma of the PLT plasma decap machine can cover a large area and react with samples with a diameter range of 70mm. Therefore, it can simultaneously open multiple different samples, effectively improving the efficiency of opening. In addition, for testing and other requirements after opening, a special adhesive can be used to protect the areas that need to be preserved, and they can be removed after decap.